Marvin Mitchell
About Marvin Mitchell
Marvin Mitchell is an Imagery Scientist with extensive experience in geospatial analysis and imagery verification. He has worked in various roles, including as an Intelligence Analyst for the US Army and as a consultant in GEOINT analysis.
Work at ECS
Marvin Mitchell has been employed at ECS as an Imagery Scientist since 2020. In this role, he focuses on analyzing photogrammetric verification and validation for newly launched National Technical Means (NTM) systems. He oversees special collections planning to optimize imagery data acquisition. His work contributes to the enhancement of imagery analysis capabilities through research and development of new technologies and sensor models.
Education and Expertise
Marvin Mitchell holds a Bachelor of Science degree, which he obtained from 2012 to 2014 while studying Computer Science with a concentration in Information Technology at Prince George Community College. He also earned an Associate of Arts and Sciences degree in Geospatial Applications and Remote Sensing from Catonsville Community College from 2017 to 2019. Additionally, he attended Strayer University-Maryland from 2010 to 2012.
Background in Military Intelligence
Marvin Mitchell has a significant background in military intelligence, having served in the US Army as an Intelligence Analyst from 2000 to 2008. During this period, he also worked as an Imagery Analyst from 2001 to 2008, gaining extensive experience in analyzing imagery data. His military service provided him with foundational skills that he has applied throughout his career.
Previous Employment Experience
Prior to his current role at ECS, Marvin Mitchell worked at Tetra Tech as a Photogrammetrist/Geospatial Analyst for five months in 2011 and 2012. He also held the position of Consultant and GEOINT Analyst at Thomas & Herbert Consulting LLC from 2019 to 2021, where he worked OCONUS. His experience includes conducting SATCOM link analysis using STK reports and performing stereo micro-DEM extraction to support volumetric spoil pile and overburden analysis.