Bagavathy Raj A.
About Bagavathy Raj A.
Bagavathy Raj A. is a Senior Staff Firmware Engineer at KIOXIA America, Inc., specializing in Data Center SSD performance architecture, analysis, and optimizations. He has over 15 years of experience in firmware design and development across various companies, including Broadcom Inc. and Seagate Technology.
Work at Kioxia
Currently, Bagavathy Raj A. serves as a Senior Staff Firmware Engineer at KIOXIA America, Inc., where he has been employed since 2018. His role focuses on Data Center SSD Performance Architecture, Analysis, and Optimizations. He has contributed to various projects aimed at enhancing the performance and reliability of SSDs in data center environments.
Previous Experience at Broadcom
Before joining Kioxia, Bagavathy Raj A. worked at Broadcom Inc. as a Staff Engineer from 2007 to 2014. During his tenure, he specialized in MegaRAID Firmware Design and Development. He played a key role in the design and development of the CacheVault feature in the Avago NytroMegaRAID series of controller firmware.
Experience at Microsemi Corporation
Bagavathy Raj A. was employed at Microsemi Corporation as a Software Engineer from 2005 to 2007. His responsibilities included RAID Firmware and Application Design and Development. This role provided him with foundational experience in firmware development.
Education and Expertise
Bagavathy Raj A. earned a Bachelor of Engineering degree in Computer Science and Engineering from the Madras Institute of Technology, Anna University, from 2001 to 2005. He has developed specialized skills in ARM/Xtensa core bootstrapping, linker script development, and ONFI protocol analysis using TLA and Cadence Palladium.
Technical Skills and Contributions
Bagavathy Raj A. possesses extensive experience in root-causing and fixing critical issues in SSD firmware. He is proficient in using in-circuit debuggers such as Xtensa, Lauterbach, and GreenHills. His expertise includes NVMe and SAS trace analysis with tools like Xgig and LeCroy, and he has contributed to the design and development of NAND firmware modules for complex 3D TLC features.