Bryan Deng
About Bryan Deng
Bryan Deng is an Associate PM Manager for Strategic Components at Acer, where he has worked since 2020. He specializes in touchpad and fingerprint technology, earthquake engineering, and packaging structure design.
Work at Acer
Bryan Deng has been employed at Acer since 2011, holding various positions that reflect his expertise in project management and engineering. He currently serves as the Associate PM Manager for Strategic Components, a role he has held since 2020. In this capacity, he develops solutions for touchpad and fingerprint technology, focusing on roadmap planning and specification reviews. Prior to this, he worked as a Packaging Eng. Associate R&D Manager from 2011 to 2016 and as a Packaging Solution Associate Project Manager from 2016 to 2017. His tenure at Acer has spanned over a decade, showcasing his commitment to the company and his contributions to product development.
Education and Expertise
Bryan Deng studied at National Central University, where he pursued a Ph.D. candidate in Civil Engineering from 2003 to 2007. His educational background has equipped him with a strong foundation in structural engineering, complemented by his expertise in earthquake engineering. This knowledge enhances his capabilities in proposal writing and project management. Additionally, he possesses skills in packaging structure design and analysis, which contribute to the efficiency of product packaging.
Background
Bryan Deng has a diverse professional background that includes significant experience in project management and engineering. He has been involved in government and emergency management projects, leveraging his engineering expertise to address complex challenges. His roles at Acer have allowed him to develop a deep understanding of sourcing and procurement for strategic components, focusing on cost management and schedule control.
Achievements
Throughout his career at Acer, Bryan Deng has played a key role in the development of innovative solutions for touchpad and fingerprint technology. His work in roadmap planning and specification reviews has contributed to the advancement of these technologies. Additionally, his experience in packaging structure design and analysis has enhanced product packaging efficiency. His involvement in various projects demonstrates his ability to apply his engineering knowledge in practical settings.