Dipak Gondaliya
About Dipak Gondaliya
Dipak Gondaliya is a Principal Engineer at KIOXIA America, Inc., with a background in electronics and communication engineering. He has held various engineering and verification roles at companies such as Broadcom Limited, Rockwell Collins, and Toshiba Memory America, Inc.
Current Role at Kioxia
Dipak Gondaliya serves as a Principal Engineer at KIOXIA America, Inc. since 2021. In this role, he applies his extensive engineering expertise to advance the company's technology initiatives. His responsibilities include overseeing engineering projects and contributing to the development of innovative memory solutions.
Previous Experience in Engineering
Prior to his current position, Dipak Gondaliya held several engineering roles. He worked as a Senior Staff Engineer at Toshiba Memory America, Inc. from 2018 to 2021. Before that, he was a Verification Consultant at Broadcom Limited and Toshiba America Electronic Components, Inc. between 2014 and 2018. His experience also includes a position as a Verification Consultant at Rockwell Collins from 2011 to 2013.
Technical Leadership at eInfochips
Dipak Gondaliya was a Technical Lead at eInfochips from 2007 to 2013. During his six years in this role, he managed various technical projects and guided teams in the development of engineering solutions. His leadership contributed to the successful execution of multiple initiatives within the organization.
Educational Background in Electronics
Dipak Gondaliya earned a Bachelor of Engineering (B.E.) degree in Electronics and Communication Engineering from Dharmsinh Desai Institute of Technology. He completed his studies from 2003 to 2007, laying a strong foundation for his career in engineering and technology.