Harvey Tran
About Harvey Tran
Harvey Tran is a Senior Staff Quality and Reliability Engineer at KIOXIA America, Inc., with extensive experience in IC packaging design and thermal simulation. He previously held positions at NVIDIA and Intel Corporation, demonstrating strong leadership and technical skills in managing projects and ensuring product quality.
Work at Kioxia
Harvey Tran serves as a Senior Staff Quality and Reliability Engineer at KIOXIA America, Inc. since 2018. In this role, he focuses on ensuring product quality and reliability throughout the development process. His responsibilities include managing teams and projects, emphasizing technical problem solving, root cause analysis, and corrective actions. Tran specializes in mechanical and thermal simulation for integrated circuit (IC) packaging, ensuring that products transition smoothly from the prototype phase to production while maintaining high standards of quality.
Current Role at NVIDIA
Since 2024, Harvey Tran has been working at NVIDIA as a Senior IC Package Design Engineer. In this position, he applies his extensive experience in IC packaging design to contribute to the development of advanced technologies. His role involves collaborating with various teams to ensure that design specifications meet performance and reliability standards. Tran's background in managing relationships with OSATs and substrate suppliers enhances his ability to deliver projects efficiently.
Previous Experience at Intel Corporation
Harvey Tran worked at Intel Corporation from 1997 to 2018, where he held positions as IC Packaging Design Lead and Thermal Mechanical Design Lead. Over his 21 years at Intel, he developed a strong foundation in IC packaging and thermal management. Tran was responsible for managing relationships with external suppliers and ensuring project timelines were met. His experience at Intel contributed significantly to his expertise in qualification testing standards and IC packaging design.
Education and Expertise
Harvey Tran earned a degree in Mechanical Engineering from the Rochester Institute of Technology. His educational background provides a solid foundation for his work in IC packaging design and reliability engineering. Tran possesses proven knowledge of qualification testing standards, including AEC, JEDEC, IPC, and MIL-STD. His expertise extends to signal integrity (SI) and power integrity (PI) considerations in IC packaging, as well as statistical analysis and geometric dimensioning and tolerancing (GD&T).
Leadership and Project Management Skills
Harvey Tran demonstrates strong leadership skills in managing teams and projects within the engineering field. He focuses on technical problem solving and has a systematic approach to root cause analysis, corrective actions, and containment strategies. His ability to transition products from prototype to production phase is complemented by his commitment to ensuring product quality and reliability. Tran's experience in managing relationships with suppliers further enhances his project management capabilities.