John Thompson
About John Thompson
John Thompson is a Firmware Engineer with a Bachelor of Science in Computer Engineering from the University of Illinois Urbana-Champaign. He has extensive experience in embedded software engineering, having worked at Qualcomm and Yohana before joining Mill in 2022.
Current Role at Mill
John Thompson currently serves as a Firmware Engineer at Mill, a position he has held since 2022. In this role, he focuses on developing and optimizing firmware solutions, contributing to the company's technological advancements. His experience in embedded systems supports Mill's objectives in delivering high-quality products.
Previous Experience at Qualcomm
Thompson has extensive experience at Qualcomm, where he worked in various capacities. He was an Embedded Software Engineer from 2011 to 2014, followed by a promotion to Senior Embedded Software Engineer from 2014 to 2016. His work involved developing embedded software solutions, enhancing product performance and reliability.
Education and Expertise
John Thompson earned a Bachelor of Science in Computer Engineering from the University of Illinois Urbana-Champaign, completing his studies from 2006 to 2010. This educational background provided him with a strong foundation in computer systems and software development, which he applies in his professional roles.
Experience at Yohana and Other Roles
Before joining Mill, Thompson worked at Yohana as an Embedded Software Engineer from 2020 to 2022. His earlier roles include an Application Developer Intern at Allstate in 2009 and a Summer Help position in Process Control at Archer Daniels Midland in 2008. He also completed an Interim Engineering Internship at Qualcomm in 2010.