Zhan Yeap Wong
About Zhan Yeap Wong
Zhan Yeap Wong is an Assembly Engineer Program Management at onsemi in Petaling Jaya, Malaysia, where he has worked since 2022. He holds a Bachelor of Engineering in Mechanical Engineering from Universiti Tunku Abdul Rahman and has extensive experience in die bonding processes.
Work at Onsemi
Zhan Yeap Wong has been employed at Onsemi since 2022, serving as an Assembly Engineer in Program Management. His role is based in Petaling Jaya, Selangor, Malaysia, where he focuses on enhancing die bonding quality and reducing manufacturing time. He employs Design of Experiments (DOE) to optimize die bonding parameters by package. Wong collaborates closely with wire bond process engineering to improve process robustness and ensure material qualification in the die bond process.
Education and Expertise
Zhan Yeap Wong holds a Bachelor of Engineering in Mechanical Engineering from Universiti Tunku Abdul Rahman (UTAR), where he studied from 2008 to 2012. Prior to this, he attended Sekolah Menengah Teknik Kuala Lumpur, focusing on Mechanical Engineering from 2005 to 2006. His educational background provides a solid foundation for his expertise in assembly engineering and process management.
Previous Experience at Texas Instruments
Before joining Onsemi, Zhan Yeap Wong worked at Texas Instruments as a Die Attach Process Engineer for a decade, from 2012 to 2022. His experience in this role involved overseeing die attach processes and contributing to advancements in manufacturing techniques. This position was based in Kuala Lumpur, Malaysia.
Early Career at Unisem
Zhan Yeap Wong began his career as an Industrial Trainee at Unisem in 2010. This position lasted for two months and took place in Ipoh, Perak, Malaysia. The experience provided him with initial exposure to the semiconductor industry and practical insights into engineering processes.