Yu Ming Lin

Yu Ming Lin

Senior Thermal Engineer @ Acer

About Yu Ming Lin

Yu Ming Lin is a Senior Thermal Engineer with extensive experience in thermal design for various product lines, including laptops and tablets. He leads a team of ODM thermal engineers and has developed new thermal technologies since joining Acer in 2018.

Work at Acer

Yu Ming Lin currently holds the position of Senior Thermal Engineer at 宏碁, where he has worked since 2018. In this role, he leads a team of ODM thermal engineers to address thermal and acoustic issues during product development. His responsibilities include overseeing the thermal design of various laptop series, specifically the Concept D, Spin, and Travelmate. Prior to his current position, he worked at 宏碁 as a Thermal Engineer from 2015 to 2018, gaining valuable experience in the field.

Education and Expertise

Yu Ming Lin earned both his Bachelor's and Master's degrees in Mechanical Engineering from 國立交通大學. He completed his Bachelor's degree from 2009 to 2013, followed by his Master's degree from 2013 to 2015. His academic background provides a strong foundation for his expertise in thermal engineering, particularly in developing systematic thermal simulation models for early-stage evaluations.

Background

Yu Ming Lin has a background in thermal engineering, focusing on the development and implementation of new thermal technologies. His experience spans a variety of product lines, including creator, convertible, and commercial laptops, as well as phones, tablets, VR headsets, and all-in-one devices. This diverse experience has equipped him with the skills necessary to tackle complex thermal design challenges.

Achievements

In his role as a Senior Thermal Engineer, Yu Ming Lin has developed new thermal technologies and implemented innovative thermal solutions in hero products. He specializes in quickly and accurately building systematic thermal simulation models using Flotherm, which aids in thermal evaluation and system placement optimization. His contributions have significantly impacted the thermal design processes within the organization.

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