Chandan Bhat
About Chandan Bhat
Chandan Bhat is a Principal Engineer at Ampere, specializing in package design and process development for advanced technologies. He has extensive experience in mechanical engineering, having worked at notable companies such as Xilinx and Cree, and holds a Master's degree from Auburn University.
Work at Ampere
Chandan Bhat has been employed at Ampere as a Principal Engineer since 2019. In this role, he is responsible for overseeing engineering projects and utilizing his expertise in package design and process development. His work focuses on advanced technologies, ensuring that products meet performance and reliability standards. His tenure at Ampere has contributed to the company's innovation in the semiconductor industry.
Previous Experience at Xilinx
Before joining Ampere, Chandan Bhat worked at Xilinx as a Staff Packaging Engineer from 2017 to 2019. During his time in San Jose, California, he was involved in the development and optimization of packaging solutions. His role required the application of advanced simulation tools to enhance product performance.
Career at Cree
Chandan Bhat served as a Packaging Engineer at Cree from 2008 to 2017. Over the course of nine years, he focused on packaging technologies, contributing to the advancement of products in the LED sector. His experience at Cree helped him develop strong skills in thermal characterization and reliability testing.
Education and Expertise
Chandan Bhat holds a Master's Degree in Mechanical Engineering from Auburn University, which he completed from 2005 to 2008. He also earned a Bachelor of Science in Mechanical Engineering from the University of Mumbai, studying from 1999 to 2003. His educational background provides a solid foundation for his expertise in mechanical and thermal simulations, as well as data analysis using tools like JMP.
Background in Engineering
Chandan Bhat began his engineering career as a Graduate Engineer Trainee at Larsen & Toubro Limited from 2003 to 2005 in Mumbai, India. This early experience laid the groundwork for his future roles in packaging engineering. His career has been marked by a focus on advanced technologies, including Flip Chip, MCM, and 2.5D packaging solutions.