Sergio Cois
About Sergio Cois
Sergio Cois is a Packaging Engineer at Arista Networks with over 5 years of experience in packaging development and testing.
Title and Current Position
Sergio Cois holds the position of Packaging Engineer at Arista Networks. He has been with the company since 2020, operating from Santa Clara, California, United States. In his role, Sergio focuses on the development of sustainable packaging solutions for server components. He ensures that the packaging solutions developed are both affordable and reliable, contributing to the overall efficiency and sustainability goals of the company.
Previous Experience at Innovated Packaging
Before joining Arista Networks, Sergio Cois worked as a Packaging Engineer at Innovated Packaging from 2018 to 2020. During his tenure in Newark, California, he was involved in the development and testing of various packaging solutions. His role likely required him to leverage his engineering skills to design and implement packaging improvements.
Research Experience at Cal Poly Packaging Research Consortium
From 2016 to 2020, Sergio Cois served as a Lead Research Assistant at the Cal Poly Packaging Research Consortium. Located in San Luis Obispo, California Area, this role allowed him to focus on packaging research, potentially involving experimentation and development of new packaging techniques or materials.
Education and Academic Background
Sergio Cois attended Cal Poly San Luis Obispo, where he studied Industrial Technology and Packaging. He achieved a Bachelor's degree after four years, from 2013 to 2017. His academic training provided him with a solid foundation in both technology and packaging, equipping him with the necessary skills for his professional career.
Specialized Skillset
With over 5 years of experience specifically in packaging development and testing, Sergio Cois has cultivated a specialized skillset in this field. His expertise lies in the creation of innovative and sustainable packaging solutions. At Arista Networks, he focuses on ensuring the affordability and reliability of protective packaging for server components.