Muthappan Alagesan
About Muthappan Alagesan
Muthappan Alagesan is a Senior PCB Layout Engineer with expertise in ensuring PCB designs meet Signal Integrity, Power Integrity, and Thermal requirements. He has worked at Bosch Global Software Technologies since 2022 and previously at Aricent Technologies for four years.
Work at Bosch Global Software Technologies
Muthappan Alagesan serves as a Senior PCB Layout Engineer at Bosch Global Software Technologies, a position he has held since 2022. In this role, he focuses on ensuring that PCB designs meet critical requirements related to Signal Integrity, Power Integrity, and Thermal performance. His responsibilities include collaborating with cross-functional teams across various time zones to enhance product delivery, thereby contributing to the efficiency and effectiveness of the engineering processes.
Previous Experience at ARICENT TECHNOLOGIES
Before joining Bosch Global Software Technologies, Muthappan Alagesan worked as a Senior PCB Layout Engineer at ARICENT TECHNOLOGIES (HOLDINGS) LIMITED from 2018 to 2022. During his four years in this role, based in Chennai, Tamil Nadu, India, he developed expertise in designing PCBs with high-density BGAs and HDI stack-ups. His experience included performing Gerber checks to maintain PCB quality and ensuring that designs adhered to industry standards.
Education and Expertise
Muthappan Alagesan earned a Bachelor of Engineering (BEng) in Electronics and Communications Engineering from ARM College of Engineering and Technology. His educational background provides a strong foundation for his work in PCB design, where he applies his knowledge to meet complex engineering requirements. He possesses specialized skills in designing high-density PCBs and is experienced in incorporating Design for Assembly (DFA), Design for Manufacturing (DFM), and Design for Testability (DFT) requirements early in the design process.
Technical Skills and Responsibilities
In his role as a Senior PCB Layout Engineer, Muthappan Alagesan ensures that PCB designs meet essential criteria such as Signal Integrity, Power Integrity, and Thermal requirements. He is skilled in performing Gerber checks to uphold PCB quality and interacts with fabrication and assembly houses to integrate design requirements effectively. His expertise in high-density BGAs and HDI stack-ups enhances the reliability and performance of the products he works on.