Dan Burgess
About Dan Burgess
Dan Burgess is a Fellow Packaging Engineer at Boston Scientific and the F02 Primary Barrier Packaging Committee Chairman at ASTM International, with extensive experience in packaging design and development.
Current Position and Role at Boston Scientific
Dan Burgess is currently serving as a Fellow, Packaging Engineer at Boston Scientific, located in the Greater Minneapolis-St. Paul Area. In this role since 2006, he applies his extensive expertise in injection molded part design and packaging engineering to ensure that medical device packaging is both functional and compliant with industry standards.
Leadership Role at ASTM International
Dan Burgess holds the position of F02 Primary Barrier Packaging Committee Chairman at ASTM International since 2018. As Chairman, he has been instrumental in facilitating the development of standards for primary barrier packaging. His leadership contributes significantly to ensuring that packaging materials meet stringent safety and performance criteria necessary for various industries.
Previous Experience in the Packaging Industry
Prior to his current roles, Dan Burgess served as the F2.50 Package Design and Development Committee Subchair at ASTM International from 2014 to 2017. His career also includes significant tenures at Stellar Mold & Tool, Inc., where he worked as a Journeyman Moldmaker from 1998 to 2004, and at Compression Engineering as a Moldmaking Apprentice from 1997 to 1998. He also worked as a Machinist at MRM Elgin from 1996 to 1997.
Educational Background in Engineering and Management
Dan Burgess possesses a robust educational foundation in both engineering and management. He earned an M.S. in Technology Management with a 3.4 GPA from the University of St. Thomas between 2007 and 2011. He holds a B.S. in Packaging from the University of Wisconsin-Stout, completed from 2004 to 2007. Additionally, he completed specialized courses in Paper Science and Engineering and Polymer/Plastics Engineering at the University of Wisconsin-Stevens Point in 2016.
Expertise in Tool and Die Making
Complementing his role in packaging design and development, Dan Burgess has a strong background in tool and die making. He completed a 4-year apprenticeship in Moldmaking at the Tri-County Tooling and Manufacturing Association from 1998 to 2002. Moreover, he earned a 2-year Technical Diploma in Machine Tool Technics from Chippewa Valley Technical College in 1997. This expertise underpins his proficiency in creating reliable and efficient packaging solutions.