William Eslinger
About William Eslinger
William Eslinger is a Principal Engineer at Boston Scientific specializing in Returns & Device Analysis with extensive experience in failure analysis and CMOS device characterization.
Title
William Eslinger serves as Principal Engineer in Returns and Device Analysis at Boston Scientific.
Company
William Eslinger is currently employed at Boston Scientific, a global medical technology company. He holds the position of Principal Engineer, focusing on Returns and Device Analysis. He has been with Boston Scientific since 2005, primarily operating from their St. Paul office.
Previous Experience
Before joining Boston Scientific, William Eslinger worked as an IC Failure Analyst at SMSC from 2001 to 2005 in Austin, Texas. Prior to SMSC, he was associated with Motorola Semiconductor, where he served as an IC Failure Analysis Engineer from 1997 to 2001 and a CMOS Process Engineer from 1994 to 1997. His career in the semiconductor industry began at IBM, where he worked as a CMOS Process Engineer from 1991 to 1994 in Manassas, Virginia.
Education and Expertise
William Eslinger completed his Bachelor of Science in Applied Math, Engineering, and Physics from the University of Wisconsin-Madison. His academic background laid the foundation for his expertise in failure analysis, CMOS device characterization, and returns analysis. Over the years, he has developed software tools using programming languages like Python, TeraTerm macro language, and JavaScript.
Technical Skills
William Eslinger possesses strong hands-on skills in failure analysis and CMOS device characterization. He is proficient in software development for testing and analysis purposes, having developed tools in Python, TeraTerm macro language, and JavaScript. Additionally, he is noted for his strong report writing capabilities, particularly in preparing technical documentation related to failure analysis.
Published Works
William Eslinger has authored several articles focused on chip-level failure analysis, sharing his extensive knowledge and findings with the wider engineering community.