Frank Jun
About Frank Jun
Frank Jun is a Principal Mechanical Design Engineer at Cerebras Systems, where he leads the development of closed-loop liquid cooling solutions for the Wafer-Scale Engine. He has a diverse background in mechanical engineering, having held various roles at companies such as Juniper Networks, AMD, and Google.
Work at Cerebras Systems
Frank Jun serves as the Principal Mechanical Design Engineer at Cerebras Systems, where he has been employed since 2017. His role involves leading the development of system-level closed-loop liquid cooling solutions specifically for the Wafer-Scale Engine. He addresses complex electro-mechanical and thermal engineering challenges associated with the full wafer-scale AI deep learning chip. Additionally, he is responsible for the industrial design and rack-level deployment solutions for Cerebras Systems' AI supercomputer. His contributions include the development of innovative mechanical and thermal solutions, for which he has been awarded a US patent.
Previous Experience
Before joining Cerebras Systems, Frank Jun accumulated extensive experience in mechanical engineering across various companies. He worked at Cisco Systems as a Technical Leader in Mechanical Engineering from 2005 to 2013. He then served as a Principal Member of Technical Staff at AMD from 2013 to 2015. Prior to that, he held the position of Staff Mechanical Design Engineer at Juniper Networks from 2015 to 2017. His earlier roles include Senior Mechanical Engineer at Allied Telesis in 2003 and Mechanical Design Engineer at Google from 2006 to 2008. He began his career as a Mechanical Engineer at Trend Technologies from 1991 to 1993.
Education and Expertise
Frank Jun studied Mechanical Engineering at the University of Washington, where he earned a Bachelor of Science in Mechanical Engineering (BSME). His educational background provides a strong foundation for his expertise in mechanical design and engineering. Throughout his career, he has focused on solving complex engineering challenges, particularly in the fields of mechanical and thermal solutions for advanced computing technologies.
Achievements
Frank Jun has been recognized for his innovative contributions to mechanical and thermal engineering. He was awarded a US patent for his groundbreaking work on chip-level packaging solutions at Cerebras Systems. His expertise in developing effective cooling solutions and addressing thermal challenges has significantly advanced the capabilities of AI supercomputing technologies.