Fei Dong
About Fei Dong
Fei Dong is a Senior Engineer with a Ph.D. in Materials Engineering from Binghamton University. He specializes in display fractography and has extensive experience in addressing solder joint issues in consumer electronics.
Work at Exponent
Currently, Fei Dong serves as a Senior Engineer at Exponent, a role he has held since 2020 in Shanghai, China. His work focuses on failure analysis, particularly in consumer electronics. He has previously worked at Exponent as an Engineer from 2018 to 2020. His expertise includes addressing solder joint related issues in various electronic products such as smartphones, tablets, and PCs.
Education and Expertise
Fei Dong earned a Doctor of Philosophy (Ph.D.) in Materials Engineering from Binghamton University, where he studied from 2014 to 2018. His academic focus included Electronic Packaging, Conformal Coating, and Bi-Ni Based TLP Bonding. He also holds a Master's Degree in Materials Science & Engineering from Tianjin University, completed from 2011 to 2014, and a Bachelor's Degree in the same field from 2007 to 2011. His specialized knowledge in display fractography enhances his capabilities in failure analysis.
Background
Fei Dong's professional background includes significant roles in academia and industry. He worked as a Research Assistant at Binghamton University from 2016 to 2018, contributing to various research projects. Additionally, he served as a Teaching Assistant at the same institution from 2014 to 2016. His industry experience includes an internship at Universal Instruments Corporation as an Advanced Process Lab Intern from 2017 to 2018.
Professional Experience
Fei Dong has accumulated diverse professional experience in engineering and research. His tenure at Binghamton University involved both teaching and research roles, where he developed skills in materials science. His internship at Universal Instruments Corporation provided practical experience in advanced process labs. His role at Exponent has allowed him to apply his academic knowledge to real-world engineering challenges, particularly in consumer electronics.