Manav Sanghvi
About Manav Sanghvi
Manav Sanghvi is the Head of Product at First Resonance, where he has worked since 2023. He has a background in mechanical engineering and has held various engineering roles at companies such as Boeing and Chip Ganassi Racing Teams.
Current Role at First Resonance
Manav Sanghvi serves as the Head of Product at First Resonance, a position he has held since 2023. In this role, he is responsible for overseeing product development and strategy, leveraging his extensive background in mechanical engineering and manufacturing solutions. His leadership aims to enhance the company's product offerings and drive innovation within the organization.
Previous Experience at First Resonance
Before becoming the Head of Product, Manav Sanghvi worked at First Resonance in multiple capacities. He served as a Manufacturing Solutions Engineer from 2022 to 2023, where he focused on optimizing manufacturing processes. Additionally, he held the position of Product Manager during the same period, contributing to product strategy and execution.
Experience at Boeing
Manav Sanghvi's tenure at Boeing spanned from 2018 to 2022, where he held various engineering roles. He worked as a Mechanical Systems Engineer for two years and later as the Reflector Products Responsible Engineering Authority (REA) for another two years. His responsibilities included developing composite sandwich panels and additively manufactured metallic products, showcasing his expertise in innovative manufacturing techniques.
Educational Background in Mechanical Engineering
Manav Sanghvi holds a Bachelor's Degree in Mechanical Engineering from the University of Illinois Urbana-Champaign, which he completed from 2014 to 2018. He furthered his education by obtaining a Master of Science in Mechanical Engineering from UCLA between 2019 and 2021. He also studied at KTH Royal Institute of Technology, achieving a Bachelor's Degree in Mechanical Engineering in 2016.
Internship and Early Career Experience
In 2015, Manav Sanghvi completed a two-month internship as a Mechanical Designer Intern at Heat Transfer Systems, Inc. in Saint Louis. He also gained experience as a Design Engineer at Chip Ganassi Racing Teams in 2017 for three months. These early roles contributed to his foundational knowledge in mechanical design and engineering.