Blake Tellefsen
About Blake Tellefsen
Blake Tellefsen is an Electrical Engineer II at General Atomics, specializing in PCB Technical Design and Development for high-speed digital applications. He holds a Master of Engineering from the University of Colorado Boulder and has been an IEEE member since 2019.
Work at General Atomics
Blake Tellefsen has been employed at General Atomics as an Electrical Engineer II since 2021. In this role, he focuses on PCB technical design and development for high-speed digital applications. Prior to his current position, he served as a Satellite Electronics Engineer at General Atomics from 2020 to 2021. He also gained experience as an Embedded Software Intern at the company in 2019, where he worked for two months. His tenure at General Atomics spans multiple roles and showcases his expertise in electrical engineering.
Education and Expertise
Blake Tellefsen earned a Master of Engineering (MEng) in Engineering Management from the University of Colorado Boulder, completing his studies from 2021 to 2023. He also holds a Bachelor of Science (BS) degree in Electrical and Computer Engineering from the same institution, which he obtained from 2015 to 2019. His educational background has equipped him with specialized knowledge in PCB technical design and development, particularly for high-speed digital applications.
Background
Blake Tellefsen is a member of the Institute of Electrical and Electronics Engineers (IEEE) since 2019. His professional journey includes a prior internship at Ricoh USA, Inc. in 2018, where he worked as a Software Intern for three months. His experience spans various roles in electrical engineering and software development, contributing to his comprehensive skill set in the field.
Previous Experience
Before his current role at General Atomics, Blake Tellefsen worked as a Satellite Electronics Engineer from 2020 to 2021. His earlier experience includes a two-month internship as an Embedded Software Intern at General Atomics in 2019 and a three-month internship as a Software Intern at Ricoh USA, Inc. in 2018. These positions provided him with practical experience in both software and hardware aspects of engineering.