Diego López Ronda
About Diego López Ronda
Diego López Ronda is a Software Engineer currently employed at Hāpara in Auckland, New Zealand, where he has worked since 2024. He has a diverse background in software development, having held various roles in different companies since 2014.
Work at Hāpara
Diego López Ronda has been employed as a Software Engineer at Hāpara since 2024. He has been working in this role for five months in Auckland, New Zealand. His responsibilities likely include software development and contributing to the company's technology solutions.
Previous Employment History
Before joining Hāpara, Diego worked at ASB Bank as a Software Engineer from 2021 to 2023 in Auckland, New Zealand. He also served as a Senior Programming Analyst at Willing Web from 2019 to 2021 in Tauranga, Bay of Plenty, New Zealand. Earlier in his career, he held positions at IQnexus as a Senior Analyst Programmer from 2017 to 2019 and at ESVAL S.A. in various roles, including Drought Plan Analyst and Senior Analyst Programmer.
Education and Expertise
Diego studied Computer Science at Duoc UC, where he achieved the title of Analyst Programmer (ANZSCO 261311) from 2011 to 2013. His educational background provides a solid foundation for his work in software engineering. He possesses strong skills in both high-level and low-level programming languages, indicating versatility in coding.
Skills and Specializations
Diego has experience working on big data projects, showcasing his expertise in handling large datasets and deriving insights. He has a comprehensive understanding of both relational and non-relational databases, which enhances his data management capabilities. Additionally, he actively seeks to strengthen business relations and expand professional connections through LinkedIn.
Professional Philosophy
Diego believes in the power of hard work, continuous learning, and determination as essential tools for achieving professional goals. This philosophy drives his approach to work and personal development in the technology field.