Huey Jiin Lim
Development Engineer Gold And Copper Wire Bond/Plasma Process @ Infineon Technologies
About Huey Jiin Lim
Huey Jiin Lim is a Development Engineer specializing in Gold and Copper Wire Bond/Plasma Process at Infineon Technologies in Melaka, Malaysia, where he has worked since 2011. He holds a Bachelor's degree in Physics from University Putra Malaysia and has completed significant projects in Six Sigma and Design of Experiment methodologies.