Stephen Tseng
3di Npi And Pie Senior Manager @ Micron Technology
About Stephen Tseng
Stephen Tseng serves as the 3di Npi And Pie Senior Manager and has a robust background in semiconductor packaging technologies, particularly in 2.5D and 3D TSV methodologies. He has held various engineering roles in notable companies, including SDI Corporation and Spil 矽品, where he contributed to the development of advanced memory packages.