Congyue Zhang
About Congyue Zhang
Congyue Zhang is a Firmware Lead with extensive experience in software engineering and embedded systems. He has worked at notable companies including Nest, Amazon, Google, and currently at Mill, where he has expanded the firmware team and led the development of the Mill Kitchen Bin.
Current Role at Mill
Congyue Zhang serves as the Firmware Lead at Mill, a position he has held since 2021. In this role, he has expanded the firmware team from a single member to a team of seven engineers. He has also led the firmware development for the Mill Kitchen Bin, overseeing the project from inception to launch. His work focuses on embedded application design and hardware bring-up, utilizing AWS IoT.
Previous Experience in Software Engineering
Congyue Zhang has extensive experience in software engineering, having worked at several prominent technology companies. He was a Software Engineer at Google from 2018 to 2021, contributing to various projects in Mountain View, California. Prior to that, he worked at Amazon Lab126 as a Software Development Engineer from 2014 to 2015 and as a Software Engineer Intern in 2013. His tenure at Nest as a Software Engineer lasted from 2015 to 2018 in Palo Alto.
Academic Background
Congyue Zhang holds a Master of Science (M.S.) degree in Computer Engineering from New York University, which he completed from 2012 to 2014. He also earned a Bachelor of Engineering (B.E.) in Electrical and Electronics Engineering from the University of Electronic Science and Technology of China, where he studied from 2008 to 2012.
Teaching Experience
Congyue Zhang has experience in academia, having served as a Teaching Assistant at NYU Polytechnic School of Engineering from 2013 to 2014 for nine months. He also worked as a Graduate Assistant at the same institution from 2012 to 2013 for nine months, contributing to the educational development of students in engineering.
Internship Experience
In addition to his professional roles, Congyue Zhang completed an internship as a Process/Equipment Engineer Intern at Intel Products in Chengdu, China, in 2011 for five months. He also gained experience as a Software Engineer Intern at Amazon Lab126 in 2013 for two months, further enhancing his skills in software development.