Gaurav Sharma
About Gaurav Sharma
Gaurav Sharma is a Senior Principal Packaging Engineer and Project Lead at NXP Semiconductors, with extensive experience in semiconductor packaging and a strong background in both technical and business aspects.
Current Position at NXP Semiconductors
Gaurav Sharma currently holds the position of Senior Principal Packaging Engineer and Project Lead for Package Innovation at NXP Semiconductors. He has been with the company since 2018, based in the Austin, Texas Area. In this role, he leads initiatives in semiconductor packaging innovation, leveraging both his technical and strategic expertise.
Previous Experience at GLOBALFOUNDRIES
From 2015 to 2018, Gaurav Sharma served as a Senior Member of Technical Staff at GLOBALFOUNDRIES. Based in the San Francisco Bay Area, he focused on advanced package development and product line management. During his tenure, he contributed to significant advancements in semiconductor packaging technologies.
Educational Background
Gaurav Sharma has a diverse and robust educational background. He earned a PhD in Materials Science and Engineering from Penn State University (2001-2005). Prior to that, he attained a Master's Degree in Metallurgical Engineering from The University of Texas at El Paso (2000-2001). He also holds a B. Tech in Metallurgical & Materials Engineering from the Indian Institute of Technology, Kanpur (1992-1996). Additionally, he completed an MBA in Strategy & Organization from the National University of Singapore (2007-2009).
Work Experience in Taiwan and Singapore
Gaurav Sharma worked extensively in Taiwan and Singapore, contributing to the semiconductor industry. From 2011 to 2015, he was a Program Manager in the Backend Business Division at TSMC in Hsinchu County/City, Taiwan. Before that, he worked at STATS ChipPAC in Singapore as a Manager for Advanced Packaging Product and Technology Management from 2010 to 2011. He also served as a Senior Research Engineer at the Institute of Microelectronics in Singapore from 2005 to 2009, focusing on interconnects and advanced packaging.
Authorship and Contributions
Gaurav Sharma has authored and presented 42 papers in international journals and conferences, highlighting his expertise in semiconductor packaging. His contributions have had a significant impact on the industry, particularly in the area of advanced packaging technologies. His work has facilitated the development of semiconductor packages that have generated lifetime revenues exceeding $1 billion.