Alex Ong Heng Giap
About Alex Ong Heng Giap
Alex Ong Heng Giap is a Senior Engineer at ON Semiconductor, specializing in experimental research on encapsulation materials for integrated circuit packaging. He has a background in Chemical Engineering from Universiti Malaya and has held various engineering roles in Malaysia and Singapore.
Work at ON Semiconductor
Alex Ong Heng Giap has been employed at ON Semiconductor since 2019, serving as a Senior Engineer in the Package Innovation & Development Center. His role involves specializing in experimental research on encapsulation materials, particularly epoxy molding compounds used in integrated circuit packaging. He conducts various analyses and tests to explore chemical phenomena related to these products. His expertise contributes to the development and innovation of packaging solutions within the semiconductor industry.
Previous Experience in Engineering
Prior to his current position, Alex worked at Top Glove as a Process Engineer for three months in 2010, located in Selangor, Malaysia. He then joined Sumitomo Bakelite, where he held the position of R&D Engineer from 2010 to 2013 in Singapore. Afterward, he advanced to the role of Senior R&D Engineer at the same company, working from 2014 to 2015. Throughout his career, he has provided technical support to customers in Southeast Asia during material evaluation and qualification phases.
Education and Expertise
Alex obtained his Bachelor of Engineering degree in Chemical Engineering from Universiti Malaya, where he studied from 2006 to 2010. His educational background laid the foundation for his expertise in experimental research and material science, particularly in the field of encapsulation materials for integrated circuits. His academic training complements his professional experience in engineering roles across various companies.
Specialization in Encapsulation Materials
Alex specializes in experimental research focused on encapsulation materials, specifically epoxy molding compounds. His work involves conducting detailed analyses and tests to investigate the chemical phenomena of products used in integrated circuit packaging. This specialization is critical for ensuring the reliability and performance of semiconductor devices.