Allan Zhou
About Allan Zhou
Allan Zhou is an NPI/Packaging Engineer at ON Semiconductor in Suzhou, Jiangsu, China, with over 15 years of experience in semiconductor product development and packaging. He has previously held engineering roles at Fairchild Semiconductor and ASUS, specializing in IGBT and MOSFET technologies.
Work at ON Semiconductor
Allan Zhou has been employed at ON Semiconductor since 2016, serving as an NPI/Packaging Engineer. His role involves overseeing new product introduction and packaging processes within the semiconductor industry. Based in Suzhou, Jiangsu, China, he has contributed to various projects and initiatives that enhance product development and manufacturing efficiency. His tenure at ON Semiconductor spans over eight years, during which he has gained significant experience in semiconductor technologies.
Previous Experience in Semiconductor Industry
Prior to his current position, Allan Zhou worked at Fairchild Semiconductor for a total of 11 years. He began as a Process Engineer from 2005 to 2010, where he focused on process optimization. He then transitioned to the role of NPI/Package Engineer from 2010 to 2016, where he contributed to new product development and packaging strategies. Earlier in his career, he also worked at ASUS as a Process Engineer from 2003 to 2005, further solidifying his expertise in the semiconductor field.
Education and Expertise
Allan Zhou holds a Bachelor's degree in Physics from Soochow University, which he attended from 1999 to 2003. His educational background provides a strong foundation for his work in the semiconductor industry. He has over 15 years of experience in new product development, packaging, research and development, and assembly processes. His expertise includes the development of IGBT, MOSFET power discrete devices, power modules, and integrated power modules for automotive, consumer, and industrial applications.
Career Development in Semiconductor Engineering
Throughout his career, Allan Zhou has focused on advancing semiconductor technologies from the concept stage to mass production. His roles have involved significant responsibilities in both process engineering and packaging engineering. This extensive experience has equipped him with a comprehensive understanding of the semiconductor manufacturing landscape, enabling him to effectively contribute to product innovation and development.