Andrew Celaya
About Andrew Celaya
Andrew Celaya is a Package Development Engineer at ON Semiconductor, where he has worked since 2015. He previously held positions as a Lab Assistant at Arizona State University and as an intern at Special Devices, Inc. and ON Semiconductor.
Work at Onsemi
Andrew Celaya has been employed at ON Semiconductor since 2015, where he holds the position of Package Development Engineer. His role involves designing and developing packaging solutions for semiconductor products. Prior to his current position, he gained valuable experience as an intern at ON Semiconductor from 2013 to 2014, where he contributed to various projects in the packaging department. His tenure at ON Semiconductor spans nearly nine years, during which he has developed expertise in semiconductor packaging technologies.
Education and Expertise
Andrew Celaya studied at the Ira A. Fulton Schools of Engineering at Arizona State University from 2011 to 2015, completing a four-year program. His education provided him with a solid foundation in engineering principles, which he applies in his current role as a Package Development Engineer. The knowledge gained during his studies has equipped him with the skills necessary to address challenges in semiconductor packaging.
Background
Before joining ON Semiconductor, Andrew Celaya worked as a Lab Assistant at Arizona State University from 2014 to 2015 for nine months. In this role, he supported laboratory operations and assisted in research activities. Additionally, he interned at Special Devices, Inc. in 2013 for three months, where he gained practical experience in the industry. His early experiences in various roles have contributed to his professional development.
Internship Experience
Andrew Celaya's internship experience includes a significant role at ON Semiconductor from 2013 to 2014, where he worked for 11 months. This position allowed him to gain hands-on experience in semiconductor packaging processes and contribute to ongoing projects. His earlier internship at Special Devices, Inc. in 2013 for three months also provided him with foundational industry experience, enhancing his skill set in engineering.