Andrew Knoop
About Andrew Knoop
Andrew Knoop is an Applications Engineering Technician at ON Semiconductor, where he has worked since 2004. He specializes in precision PCB components and has experience in developing automated test systems and managing lab operations.
Work at ON Semiconductor
Andrew Knoop has been employed at ON Semiconductor as an Applications Engineering Technician since 2004. Over his 20 years in this role, he has developed a strong proficiency in handling and modifying precision PCB components, including QFN, DFN, BGA, 0402, and 0201. His responsibilities include managing lab operations and equipment, ensuring efficient workflow and adherence to safety standards. Knoop also plays a key role in the characterization of new silicon through probing and laser cutting of open die.
Previous Experience at Primarion
Before joining ON Semiconductor, Andrew Knoop worked at Primarion as a Design / Engineering Technician from 2001 to 2003. During his two years in this position, he gained valuable experience in design and engineering processes, contributing to the development of electronic components and systems.
Education and Expertise
Andrew Knoop studied at ITT Technical Institute, where he earned an Associate's degree in Electronics Engineering from 1992 to 1995. His education provided him with a solid foundation in electronics, which he has applied throughout his career. Knoop possesses expertise in developing automated test systems using LabView and GPIB interfaced equipment, as well as utilizing advanced lab equipment such as FLIR Thermal Cameras and Network Analyzers for testing and validation.
Technical Skills and Responsibilities
In his current role, Andrew Knoop is responsible for developing automated test systems and utilizing advanced lab equipment for testing and validation purposes. He manages lab operations, ensuring that equipment is maintained and that safety standards are met. His technical skills include the characterization of new silicon, where he employs probing and laser cutting techniques to analyze open die.