Andy James
About Andy James
Andy James is a Senior Principle Physical Design Engineer at ON Semiconductor in Swindon, United Kingdom, with over 20 years of experience in the semiconductor industry. He specializes in Agile project management and has contributed to various design processes and tools throughout his career.
Work at Onsemi
Andy James has been employed at ON Semiconductor as a Senior Principal Physical Design Engineer since 2017. He has worked in this role for seven years at the company's facility in Swindon, United Kingdom. His responsibilities include overseeing physical design processes and contributing to the development of semiconductor technologies. His experience in this position allows him to apply his extensive knowledge in the semiconductor industry to enhance design workflows and project outcomes.
Previous Experience in Semiconductor Industry
Prior to his current role, Andy James worked at NXP Semiconductors as a Design Flow Specialist from 2005 to 2010. He also held positions at Intel Corporation, where he served as a Physical Design Engineer from 2011 to 2017 and as an IC Implementation Contractor from 2010 to 2011. Earlier in his career, he worked at Zarlink Semiconductor as a Chip Implementation Engineer from 2001 to 2005. This diverse experience across multiple companies has equipped him with a comprehensive understanding of physical design and implementation processes.
Education and Expertise
Andy James studied at the University of Gloucestershire, where he earned a Higher National Certificate (HNC) in Computing from 1978 to 1980. His educational background laid the foundation for his career in the semiconductor industry. He specializes in Agile project management and has developed skills in software development, utilizing programming languages such as C, Tcl/Tk, and Perl. His expertise extends to flow scripting and technical authoring, which are essential for digital chip implementation.
Achievements in Physical Design
During his career, Andy James developed a 45nm flip chip flow that won an internal Business Improvement Competition award. This achievement highlights his capability in enhancing design processes within the semiconductor field. Additionally, he consulted on the NXP Pad Ring Builder tool, which improved I/O ring construction capabilities, showcasing his contributions to advancing industry standards and practices.