Argie Nuqui
About Argie Nuqui
Argie Nuqui is a Wirebond Engineer currently employed at ON Semiconductor in the Philippines, where he has worked since 2018. He previously held positions at Infineon Technologies and STMicroelectronics, contributing to his expertise in the field of electronics and communications engineering.
Current Role at ON Semiconductor
Argie Nuqui serves as a Wirebond Engineer at ON Semiconductor, a position held since 2018. In this role, he is responsible for wire bonding processes, which are critical in semiconductor packaging. His expertise contributes to the efficiency and effectiveness of production operations within the company. ON Semiconductor is known for its focus on energy-efficient solutions and innovative semiconductor technologies.
Previous Experience at Infineon Technologies
Prior to his current role, Argie Nuqui worked at Infineon Technologies as a Process Integration Engineer from 2015 to 2018. During his three years there, he focused on integrating various processes to enhance semiconductor manufacturing efficiency. His experience at Infineon Technologies provided him with a solid foundation in process optimization and engineering principles.
Experience at STMicroelectronics
Before joining Infineon Technologies, Argie Nuqui was employed at STMicroelectronics as an NPI Wirebond Senior Engineer from 2012 to 2015. In this position, he was involved in new product introduction (NPI) processes, specifically focusing on wire bonding techniques. His role contributed to the successful launch of new semiconductor products in the market.
Education in Electronics and Communications Engineering
Argie Nuqui earned his Bachelor's Degree in Electronics and Communications Engineering from Adamson University, completing his studies from 2001 to 2006. This educational background provided him with essential knowledge and skills in electronics, communications, and engineering principles, which he has applied throughout his career in the semiconductor industry.