Atapol Prajuckamol
About Atapol Prajuckamol
Atapol Prajuckamol is a Sr. Principal Package Development Engineer at ON Semiconductor, specializing in semiconductor packaging with over 20 years of experience. He focuses on package design, cost estimation, and manufacturing efficiency, and holds patents for his contributions to the field.
Work at ON Semiconductor
Atapol Prajuckamol has been employed at ON Semiconductor since 2005, serving as a Senior Principal Package Development Engineer. In this role, he focuses on developing processes and technologies related to semiconductor packaging. His responsibilities include conducting assembly cost estimation and cost structure analysis, as well as implementing cost reduction programs. Prajuckamol's extensive experience at ON Semiconductor spans 19 years, during which he has specialized in various aspects of package design and development.
Education and Expertise
Atapol Prajuckamol earned a Bachelor of Engineering (B.E.) degree in Mechanical Engineering from King Mongkut's University of Technology North Bangkok, where he studied from 1991 to 1995. His educational background has provided him with a strong foundation in engineering principles, which he applies in his work in semiconductor packaging. Prajuckamol possesses expertise in package and leadframe, clip, and substrate design, emphasizing cost, quality, and manufacturing efficiency.
Background
With over 20 years of experience in semiconductor packaging, Atapol Prajuckamol has developed a specialization in various package types, including conventional IC packages, chipscale packages, power packages, and power module packages. His extensive background in the industry has equipped him with the skills necessary to evaluate materials and equipment for semiconductor packaging, contributing to advancements in the field.
Achievements
Atapol Prajuckamol has made significant contributions to the field of semiconductor packaging, including the development of breakthrough solutions. He holds patents related to his work, reflecting his innovative approach and commitment to advancing packaging technologies. His focus on cost reduction and efficiency has also led to the successful implementation of various cost reduction programs within his role.