Changsun Yun
About Changsun Yun
Changsun Yun is a Sr. Principal Engineer in the Package Development Group at ON Semiconductor, where he has worked since 2009. He specializes in thermal resistance characterization and has extensive expertise in laboratory instrument automation and packaging materials.
Work at Onsemi
Changsun Yun has been employed at ON Semiconductor since 2009, where he holds the position of Sr. Principal Engineer in the Package Development Group. His role involves overseeing the development and optimization of packaging solutions for semiconductor devices. He has contributed significantly to the company's efforts in enhancing package reliability and performance, particularly in the context of power management applications.
Previous Experience at KCC Corporation
Before joining ON Semiconductor, Changsun Yun worked at KCC Corporation as an Engineer from 2002 to 2009. During his seven years at the company, he gained valuable experience in the field of engineering, which laid the foundation for his future roles in semiconductor packaging and development.
Education and Expertise
Changsun Yun holds a Master's degree in Chemical Engineering from Yonsei University, which he completed from 2010 to 2013. He also earned a Bachelor's degree in Chemical Engineering from Sungkyunkwan University, studying there from 1993 to 2000. His academic background provides him with a strong foundation in chemical processes and materials science, which he applies in his professional work.
Specialization in Thermal Resistance Characterization
Changsun Yun specializes in thermal resistance characterization for power management applications. His expertise includes laboratory instrument automation and numerical analysis, which are critical for assessing the thermal performance of packaging materials. He conducts studies focused on the impact of material characteristics on package reliability, contributing to advancements in semiconductor technology.
Expert Knowledge in Packaging Materials
Changsun Yun possesses expert knowledge in various packaging materials, including molding compounds, silicone, and paste. His understanding of these materials is essential for developing reliable semiconductor packages. He actively conducts research to evaluate how different material properties affect the overall reliability of packaging solutions.