Chia Hao Kang
About Chia Hao Kang
Chia Hao Kang is a Principal Engineer at 安森美半导体 in 新竹縣竹北市, with extensive experience in semiconductor manufacturing and engineering roles. He previously worked at 日月光集團 for over a decade in various engineering capacities and holds master's and bachelor's degrees in physics from 國立成功大學 and 國立高雄師範大學, respectively.
Current Role at Onsemi
Chia Hao Kang has been serving as a Principal Engineer at Onsemi since 2018. In this role, he manages operational key performance indexes for contracted manufacturers and acts as the manufacturing site owner. His responsibilities include addressing quality complaints, ensuring yield improvements, and securing line capacity. He focuses on cycle time and material on-time delivery, ensuring that production processes run smoothly and efficiently.
Previous Experience at 日月光集團
Before joining Onsemi, Chia Hao Kang worked at 日月光集團 in various engineering roles from 2004 to 2017. He started as a Process Engineer and later transitioned to Integration/Yield Improvement Engineer and Package/Product Engineer. His tenure at 日月光集團 lasted for a total of seven years, where he gained extensive experience in semiconductor manufacturing processes, particularly in Kaohsiung, Taiwan.
Experience at NXP Semiconductors
Chia Hao Kang briefly worked at NXP Semiconductors as a Senior Engineer from 2017 to 2018. During this year, he contributed to engineering projects and initiatives in the semiconductor sector, further enhancing his expertise in the field before moving to his current position at Onsemi.
Educational Background
Chia Hao Kang holds a Master's degree in Physics from 國立成功大學, where he studied from 2000 to 2002. He also earned a Bachelor's degree in Physics from 國立高雄師範大學. His academic background in physics provides a strong foundation for his engineering roles in the semiconductor industry.
Key Responsibilities and Leadership
In his current role, Chia Hao Kang leads quality and yield improvement efforts for contracted manufacturers. He interacts daily with strategic semiconductor manufacturers, focusing on bump/RDL, DPS/BE, and WLP/WLCSP processes. He also oversees the flow of change control processes, including CAB, PCN, and FCN, ensuring that all changes are effectively managed and implemented.