Chun Haur Khoo
About Chun Haur Khoo
Chun Haur Khoo is a Senior Failure Analysis Engineer at onsemi with extensive experience in reliability and failure analysis across multiple companies, including Fairchild and OSRAM. He holds degrees in Electronic Engineering and Microelectronics and has contributed to significant improvements in production yield and capacity.
Work at Onsemi
Chun Haur Khoo has been employed at onsemi as a Senior Failure Analysis Engineer since 2015. In this role, he has contributed to the characterization and release of new OBIRCH and PEM tools for the South Portland Failure Analysis lab. His responsibilities include developing new analysis techniques to support new product development. His expertise in failure analysis is complemented by hands-on skills with various fault isolation tools, enhancing the lab's operational capabilities.
Previous Experience in Reliability and Failure Analysis
Before joining onsemi, Chun Haur Khoo worked at Fairchild as a Reliability and Failure Analysis Engineer from 2007 to 2012 in Penang, Malaysia. He played a key role in the purchase and transfer of a scanning electron microscope for the Fairchild Penang FA lab. Following his tenure at Fairchild, he served as a Senior Reliability and Failure Analysis Engineer at OSRAM for 10 months in 2013, and as a Manufacturing Engineer at Schlumberger from 2013 to 2015, where he achieved significant production yield and capacity improvements.
Education and Expertise
Chun Haur Khoo holds an Advanced Diploma and Diploma in Electronic Engineering from Kolej Tunku Abdul Rahman (TARC), where he studied from 2003 to 2007. He furthered his education at Liverpool John Moores University, earning a Bachelor's degree in Microelectronics in 2007. His academic background provides a solid foundation for his expertise in failure analysis, material analysis, and circuit tracing.
Achievements in Failure Analysis
Chun Haur Khoo has made notable contributions to the field of failure analysis, including the publication of a paper titled 'Creative Approaches for Thermal Hot Spot Identification on Analog IC' at ISTFA 2021. He has also developed new analysis techniques, including a publication on WLCSP Laminate Removal Using NIR Laser at ISTFA 2018. His work has led to the characterization and implementation of advanced tools and techniques in failure analysis labs.
Technical Skills and Capabilities
Chun Haur Khoo possesses advanced material analysis capabilities, utilizing techniques such as x-ray, jet etching, chemical and laser decapsulation, die delayering with chemical methods, SEM, and EDX analysis. He has hands-on experience with various fault isolation tools, including OBIRCH, TIVA, EMMI, and Thermal Hot Spot techniques, which are essential for effective defect localization during the failure analysis process.