Cleofas Mariano Pascual Ordona
About Cleofas Mariano Pascual Ordona
Cleofas Mariano Pascual Ordona is a Wirebond Engineer and Process Engineer with extensive experience in the semiconductor industry, specializing in wirebond processes and methodologies. He has worked for several notable companies, including NXP Semiconductors, STATS ChipPAC, and onsemi, and holds degrees in Electrical Technology and Electrical Engineering from the Technological University of the Philippines.
Work at Onsemi
Currently, Cleofas Mariano Pascual Ordona serves as a Wirebond Engineer-Process Engineer at onsemi. He has been in this role since 2020, contributing to engineering projects in Seremban, Negri Sembilan, Malaysia. His responsibilities include focusing on wirebond processes and ensuring quality standards are met. Ordona's expertise in wirebond technology supports the company's commitment to innovation and customer satisfaction.
Education and Expertise
Cleofas Mariano Pascual Ordona studied at the Technological University of the Philippines, where he earned a Bachelor’s degree in Electrical Engineering from 2001 to 2006. He also completed a program in Electrical Technology from 1995 to 2000. His educational background provides a strong foundation for his expertise in wirebond engineering, particularly in gold and copper wire, clip bonding, and QFN/SOSM processes.
Background in Semiconductor Industry
Ordona has extensive experience in the semiconductor industry, having worked for several notable companies. He began his career as an On the Job Trainee at Amkor Technology, Inc. in 1997. He then progressed to roles at Amkor Technology as an Equipment Specialist II, Cypress Semiconductor as an Equipment Technical Specialist, and NXP Semiconductors as a Process Engineer. His diverse background includes significant tenures at STATS ChipPAC and ON Semiconductor.
Achievements in Engineering Projects
Throughout his career, Cleofas Mariano Pascual Ordona has demonstrated a strong customer focus in engineering projects. He specializes in DMAIC methodology and New Product Introduction (NPI), which are critical for process improvement and product development. As a BP/LL Department Champion, he emphasizes yield and quality improvement initiatives, contributing to enhanced operational efficiency.