Cristian Stancu
About Cristian Stancu
Cristian Stancu is a Design Engineer Team Lead at ON Semiconductor in Bucharest, Romania, where he has worked since 2019. He holds a Master of Engineering and is currently pursuing a PhD in Electronic Engineering at Universitatea POLITEHNICA din București.
Work at ON Semiconductor
Cristian Stancu has been employed at ON Semiconductor since 2019, serving as a Design Engineer Team Lead. His role is based in Bucharest, Romania, where he has accumulated five years of experience in the semiconductor industry. Prior to his current position, he completed two internships at ON Semiconductor, one as an intern in 2018 for three months and another as a Design Intern in 2019 for six months. These experiences provided him with foundational knowledge and skills in design engineering within the semiconductor sector.
Education and Expertise
Cristian Stancu has a strong educational background from Universitatea POLITEHNICA din București. He earned his Bachelor of Engineering in Monoelectronica, Optoelectronica si Nanotehnologii from 2015 to 2019. Following this, he pursued a Master of Engineering in Microelectronica si Nanotehnologii, completing it from 2019 to 2021. Currently, he is working towards a PhD in Inginerie Electronică, Telecomunicaţii și Tehnologii Informaționale, which he is expected to complete in 2024. His academic focus aligns with his professional role in design engineering.
Background
Cristian Stancu has developed a career in the semiconductor industry, specifically with ON Semiconductor in Bucharest, Romania. His journey began with a Bachelor’s degree, followed by advanced studies leading to a Master’s degree and ongoing PhD studies. This educational path has equipped him with specialized knowledge in microelectronics and nanotechnologies, which he applies in his current role as a Design Engineer Team Lead.
Professional Development
Cristian Stancu's professional development includes significant practical experience gained through internships at ON Semiconductor. His initial internship in 2018 allowed him to familiarize himself with the operational aspects of the semiconductor industry. This was followed by a Design Internship in 2019, where he further honed his design engineering skills. These experiences have contributed to his current role and responsibilities as a Design Engineer Team Lead.