David Gastelum
About David Gastelum
David Gastelum is a Packaging Engineer with extensive experience in the semiconductor industry, currently employed at ON Semiconductor since 2011. He has held previous positions as Design Manager at STATS ChipPAC and Amkor Technology, and as Package Design and Development Engineer at Quicklogic.
Work at ON Semiconductor
David Gastelum has been employed at ON Semiconductor since 2011, where he holds the position of Packaging Engineer. His role involves the design and development of packaging solutions for semiconductor products. Over the years, he has contributed to various projects that enhance product performance and reliability.
Previous Experience in Packaging Engineering
Before joining ON Semiconductor, David Gastelum worked at several notable companies in the semiconductor industry. He served as Design Manager at STATS ChipPAC from 1999 to 2004, where he managed design teams and projects. Following this, he held the same title at Amkor Technology from 2004 to 2007, further honing his skills in packaging design. He then worked at Quicklogic as a Package Design and Development Engineer from 2007 to 2010, focusing on innovative packaging solutions.
Education and Expertise
While specific educational details are not provided, David Gastelum's extensive experience in the semiconductor packaging field indicates a strong background in engineering principles and practices. His expertise encompasses various aspects of packaging design, development, and management, gained through years of hands-on experience across multiple companies.
Career Timeline
David Gastelum's career in the semiconductor industry spans over two decades. He began his career at STATS ChipPAC in 1999, where he worked for five years. He then transitioned to Amkor Technology for three years, followed by a three-year tenure at Quicklogic. Since 2011, he has been with ON Semiconductor, accumulating over 13 years of experience in his current role.