David Roy
About David Roy
David Roy serves as the Process Engineering Manager at ON Semiconductor in Burlington, Ontario, where he has worked since 2020. He has over a decade of experience in process engineering and holds multiple patents related to his work.
Work at ON Semiconductor
David Roy has been serving as the Process Engineering Manager at ON Semiconductor since 2020. He is based in Burlington, Ontario, Canada. In this role, he oversees various engineering processes and initiatives within the company. Prior to his current position, he worked as a Process Engineering Supervisor at ON Semiconductor from 2010 to 2020, where he contributed significantly to the development of manufacturing capabilities.
Education and Expertise
David Roy studied at the University of Guelph from 1983 to 1986, where he gained foundational knowledge in engineering. He has specialized as a RoHS specialist, focusing on compliance with environmental standards. His expertise in process engineering is complemented by his extensive experience in the semiconductor industry.
Background in Process Engineering
Before joining ON Semiconductor, David Roy worked at Gennum Corporation as an Intermediate Process Engineer from 2001 to 2007. His career in process engineering spans over two decades, during which he has developed various technologies and manufacturing processes. His work includes significant contributions to multilayer thickfilm systems and packaging technologies.
Achievements in Technology Development
David Roy has made notable contributions to technology development in the semiconductor field. He developed a multilayer thickfilm on AlN substrate in 2008 and led the introduction of an HDI Ag thickfilm system on Al2O3 and AlN substrates in 2009. Additionally, he pioneered ultrathin flipchip packaging technology with integrated circuits less than 50um thick in 2009. He holds three granted patents and has one patent pending.
Contributions to Manufacturing Capabilities
In 2010, David Roy introduced the Optical Assembly manufacturing capability to the Burlington facility of ON Semiconductor. This initiative enhanced the manufacturing processes and capabilities of the facility, demonstrating his leadership in advancing operational efficiency and technology integration.