Denise Thienpont
About Denise Thienpont
Denise Thienpont is a Package Development Engineer with a Bachelor of Applied Science in Materials Engineering from the University of Illinois at Urbana-Champaign. She also pursued further studies at Arizona State University.
Work at Onsemi
Denise Thienpont holds the position of Package Development Engineer at Onsemi. In this role, she is involved in the design and development of packaging solutions for semiconductor products. Her work contributes to the advancement of technology in the semiconductor industry, focusing on improving product performance and reliability.
Education and Expertise
Denise Thienpont earned a Bachelor of Applied Science (BASc) in Materials Engineering from the University of Illinois at Urbana-Champaign. She also pursued further studies at Arizona State University. Her educational background provides her with a strong foundation in materials science, which is essential for her role in package development.
Background
Denise Thienpont has a background in materials engineering, which informs her approach to package development in the semiconductor field. Her academic training equips her with the necessary skills to address challenges in material selection and packaging design.