Dr Daniel Tekleab
About Dr Daniel Tekleab
Dr. Daniel Tekleab is a Principal Engineer at ON Semiconductor with extensive experience in semiconductor technology, specializing in process integration and TCAD simulation. He holds a PhD in Physics from Clemson University and has 15 issued US patents in his field.
Work at Onsemi
Dr. Daniel Tekleab has been employed at ON Semiconductor since 2014, where he currently holds the position of Principal Engineer in the Optoelectronic Device division. His tenure at ON Semiconductor spans over 10 years, during which he has contributed to advancements in semiconductor technology. In addition to his role as Principal Engineer, he has also served as a Member of Technical Staff since 2015. His work focuses on process integration and TCAD simulation, leveraging his extensive experience in the semiconductor field.
Previous Experience in Semiconductor Industry
Dr. Tekleab has a diverse background in the semiconductor industry, having worked at several prominent companies. He was a Senior Modeling Engineer at Freescale Semiconductor from 2001 to 2008, where he spent 7 years developing modeling techniques. Following that, he worked at IBM from 2008 to 2011 as a specialist in predictive modeling for process and device simulation for 3 years. He then joined Aptina, where he worked from 2011 to 2015 as a Semiconductor Process and Device Modeling Engineer, focusing on TCAD.
Education and Expertise
Dr. Tekleab earned his PhD in Physics from Clemson University, where he studied from 1996 to 2000. His academic background also includes a Master of Science in Electrical Engineering, with a focus on Physics and Astronomy within the Department of Electrical & Computing Engineering. His education has laid a strong foundation for his expertise in semiconductor technology, particularly in areas such as nano-scale CMOS, LDMOS, and LIGBT technologies.
Patents and Innovations
Dr. Tekleab holds 15 issued US patents in the field of semiconductor technology. His patents reflect his contributions to advancements in device design, modeling, and characterization. His work particularly emphasizes CMOS image sensors and ultra-shallow junctions, showcasing his innovative approach to semiconductor processes and technologies.
Technical Skills and Specializations
Dr. Tekleab specializes in process integration and TCAD simulation, with extensive experience in front-end technology and device/process simulation. He is proficient in using BSIM3 and BSIM4 models, which are critical for accurate device modeling. His technical skills encompass CMOS and BiCMOS VLSI technology, as well as high voltage power semiconductor devices, making him a valuable asset in the semiconductor industry.