Erik Nino Tolentino
About Erik Nino Tolentino
Erik Nino Tolentino is a Technical Staff Package Development Engineer with extensive experience in power module engineering and package failure analysis. He currently works at Dynex Semiconductor Ltd in the UK and has a strong background in material science and equipment maintenance.
Work at Dynex Semiconductor Ltd
Erik Nino Tolentino has been employed at Dynex Semiconductor Ltd as a Senior Power Module Engineer since 2021. In this role, he focuses on the development and enhancement of power modules, contributing to the company's advancements in semiconductor technology. His responsibilities include package failure analysis and the application of advanced analytical tools. His tenure at Dynex Semiconductor has been marked by a commitment to improving product reliability and performance.
Work at ON Semiconductor
Since 2013, Erik Nino Tolentino has served as a Technical Staff Package Development Engineer at ON Semiconductor in Negeri Sembilan, Malaysia. His role involves the development of packaging solutions for semiconductor devices. He utilizes his extensive knowledge in material science and engineering to innovate and improve packaging processes. His long-standing position at ON Semiconductor reflects his expertise and contributions to the field of semiconductor packaging.
Education and Expertise
Erik Nino Tolentino holds a Bachelor's degree from the University of Baguio, which he completed from 2000 to 2004. He furthered his education by obtaining a Master's degree from the University of Malaya between 2017 and 2021. His academic background supports his extensive knowledge in material science, particularly in nanosilver sintering paste and solder alloy paste. He is also skilled in Six Sigma methodologies and proficient in statistical analysis using JMP.
Background in Equipment Engineering
Erik Nino Tolentino has a diverse background in equipment engineering, having worked at Texas Instruments as an Equipment Engineer Breakthrough from 2009 to 2013. Prior to that, he was an Equipment Maintenance Technician at Amkor Technology from 2005 to 2009. His experience spans various roles that have equipped him with hands-on expertise in die-attach processes and the operation of specialized equipment used in semiconductor manufacturing.
Technical Skills and Tools
Erik Nino Tolentino possesses advanced technical skills in package failure analysis, utilizing tools such as Scanning Electron Microscope (SEM), Energy Dispersive Analysis X-ray (EDX), and Fourier Transform Infrared Spectroscopy (FTIR). He has extensive hands-on experience with equipment including ASM 838/8312, BESTEMD01/D02, and Shinkawa300/400. Additionally, he is capable of developing new design assembly packaging concepts using software tools like AutoCAD and SOLIDWORKS.