Esmawi Sham
About Esmawi Sham
Esmawi Sham is a Failure Analysis Engineer at ON Semiconductor in Malaysia, specializing in quality and failure analysis of semiconductor devices. He has extensive experience with various failure analysis techniques and holds a Bachelor's degree in Electronic Engineering with Honours.
Work at ON Semiconductor
Esmawi Sham has been employed at ON Semiconductor since 2015, serving as a Failure Analysis Engineer in Malaysia. In this role, he specializes in conducting quality and failure analysis investigations of components, assemblies, and manufacturing processes. His responsibilities include performing in-depth electrical and physical analysis on semiconductor devices to identify failure mechanisms. Prior to his current position, he worked as a Failure Analysis Technician at ON Semiconductor from 2011 to 2012, where he gained foundational experience in the field.
Education and Expertise
Esmawi Sham holds a Bachelor's degree in Electronic Engineering with Honours from Universiti Tun Hussein Onn Malaysia, where he studied from 2012 to 2015. He also earned a Diploma in Electronic Engineering from Politeknik Port Dickson, completing his studies there from 2008 to 2011. His educational background provides a strong foundation for his expertise in failure analysis techniques and equipment, including SAT, SEM, EDX, PEM, OBIRCH, CURVE TRACER, and XRAY.
Background
Esmawi Sham began his career in the semiconductor industry as a Failure Analysis Technician at ON Semiconductor, where he worked for nine months before transitioning to his current role as a Failure Analysis Engineer. His experience spans over a decade in the field, with a focus on quality and failure analysis investigations. His background in electronic engineering supports his ability to apply advanced problem-solving techniques in his analyses.
Achievements in Failure Analysis
In his role as a Failure Analysis Engineer, Esmawi Sham routinely operates scanning electron microscopes (SEM) and performs x-ray microanalysis using EDX to conduct failure analyses. He is involved in developing and documenting failure analysis methods related to FIB, SEM, and EDX, which enhances process efficiency. Additionally, he applies continuous process improvement strategies to failure analysis tools and methods, ensuring optimal performance in his investigations.