Harold Anderson
About Harold Anderson
Harold Anderson is a Principal Staff Packaging Engineer at ON Semiconductor, where he leads technology development in copper wire interconnects. He has over 25 years of experience in package interconnect technologies and previously worked at Motorola for 14 years.
Work at ON Semiconductor
Harold Anderson currently serves as a Principal Staff Packaging Engineer at ON Semiconductor. He has been with the company since 1999, accumulating 25 years of experience in this role. Prior to his current position, he worked as a Package Development Engineer from 1995 to 2016, where he contributed to various packaging technologies. His leadership in the technology development team focused on the migration to copper wire interconnects, showcasing his expertise in package interconnect technologies.
Education and Expertise
Harold Anderson earned a Bachelor of Science degree in Industrial Engineering Technology from Arizona State University, completing his studies from 1981 to 1986. His educational background supports his extensive knowledge in engineering principles and practices. He specializes in package interconnect technologies, including wire bond, clip-attach, and bump techniques, and has significant experience with wire bonding using materials such as aluminum, gold, and copper.
Background in Motorola
Before joining ON Semiconductor, Harold Anderson worked at Motorola as an Equipment & Process Development Engineer from 1985 to 1999. During his 14 years at Motorola, he developed skills in equipment and process development, which laid the foundation for his later work in packaging engineering. His experience at Motorola contributed to his understanding of manufacturing processes and technology development.
Specialization in Packaging Technologies
Harold Anderson specializes in various package interconnect technologies. His expertise includes wire bond, clip-attach, and bump techniques, which are critical in semiconductor packaging. His role at ON Semiconductor involves leading initiatives that enhance packaging performance and reliability, particularly through advancements in interconnect materials and methods.