Hee Jo Chi
About Hee Jo Chi
Hee Jo Chi is an Automotive Power Module Package Development Engineer at ON Semiconductor, specializing in semiconductor packaging assembly processes and materials. With over 22 years of experience in the industry, he has a strong background in automotive package reliability and design optimization.
Work at ON Semiconductor
Hee Jo Chi has been employed at ON Semiconductor since 2017, serving as an Automotive Power Module Package Development Engineer. In this role, he focuses on the development and production release of various automotive power module packages, including technologies such as Mosfet, IGBT, SiC, APM, IPM, AHPM, and direct cooling. His responsibilities include ensuring compliance with automotive package reliability requirements and utilizing advanced simulation techniques for package design optimization.
Education and Expertise
Hee Jo Chi holds a Bachelor of Engineering degree in Electronics Engineering from Chungnam National University. His educational background supports his extensive expertise in semiconductor packaging assembly processes and materials. He possesses a comprehensive understanding of automotive package development procedures, including APQP, FMEA, Control Plan, and PPAP, which are critical for ensuring quality and reliability in automotive applications.
Background in Semiconductor Packaging
Before joining ON Semiconductor, Hee Jo Chi worked at STATS ChipPAC Ltd. for 15 years, where he served as a Mobile SOC/SiP Package Development Engineer. His experience in this role contributed to his knowledge of packaging technologies and processes, further enhancing his skills in the semiconductor industry. His background includes a focus on package reliability and development, which is essential for the automotive sector.
Technical Skills and Methodologies
Hee Jo Chi is proficient in utilizing FEM simulation and evaluation, along with Design of Experiments (DOE) and statistical analysis tools. These skills are applied to optimize package design and address process and reliability issues. His familiarity with automotive package reliability standards, such as AEC-Q100/101/102, AQG324, and JEDEC, underlines his commitment to maintaining high-quality standards in automotive applications.