Hui Min Ler
About Hui Min Ler
Hui Min Ler serves as a Principal Engineer in New Package Development at ON Semiconductor, a position she has held since 2021 in Phoenix, Arizona.
Work at ON Semiconductor
Hui Min Ler serves as a Principal Engineer in New Package Development at ON Semiconductor. She has held this position since 2021, contributing to the company's advancements in semiconductor packaging technology. Located in Phoenix, Arizona, she plays a key role in developing innovative packaging solutions that meet industry standards and client needs.
Professional Role and Responsibilities
In her role as Principal Engineer, Hui Min Ler is responsible for overseeing the development of new packaging technologies. This includes designing, testing, and implementing packaging solutions that enhance the performance and reliability of semiconductor products. Her expertise is crucial in ensuring that the packaging meets both technical specifications and market demands.
Background
Hui Min Ler has a background in engineering, with a focus on semiconductor packaging. Her experience spans several years in the industry, where she has developed a strong understanding of the technical requirements and challenges associated with new package development.
Career Timeline
Hui Min Ler has been with ON Semiconductor since 2021, marking a significant phase in her career. Her tenure at the company has allowed her to leverage her skills in a dynamic environment, contributing to various projects aimed at enhancing semiconductor packaging.