Hyemin Paek
About Hyemin Paek
Hyemin Paek is a SiC Process Integration Engineer at onsemi in Bucheon, South Korea, where he has worked since 2021. He previously served as a package Process Engineer at JCET Group and has expertise in SoC/SiP device package engineering and quality qualification programs.
Work at Onsemi
Hyemin Paek has been employed at Onsemi since 2021, serving as a SiC Process Integration Engineer. In this role, he is based in Bucheon, Gyeonggi, South Korea. His responsibilities include leading projects related to System on Chip (SoC) and System in Package (SiP) device package engineering. He focuses on the assembly processes for 5G modules and SoC devices, ensuring that the integration of these technologies meets industry standards.
Previous Experience at JCET Group
Prior to joining Onsemi, Hyemin Paek worked at JCET Group from 2019 to 2021 as a Package Process Engineer. During his tenure in Incheon, South Korea, he gained valuable experience in package engineering, contributing to various projects that enhanced the efficiency and effectiveness of packaging processes.
Project Management in SiP Device Projects
In his current role, Hyemin Paek serves as a project manager for SiP device projects. This position involves overseeing the development and implementation of packaging solutions for advanced semiconductor devices. His project management skills are essential for coordinating efforts across teams and ensuring timely delivery of project milestones.
SiC Sub/Epi Quality Qualification Program Management
Hyemin Paek manages the SiC Sub/Epi Quality Qualification Program, which emphasizes the qualification of new vendors. This program is critical for maintaining high standards in the supply chain and ensuring that all components meet the necessary quality requirements for SiC technology.
Expertise in SiC MosFET Processes
Hyemin Paek has experience in setting up SiC MosFET processes, which are vital for the development of efficient power devices. His expertise in this area contributes to advancements in semiconductor technology, particularly in applications requiring high efficiency and performance.