Ingoo Kang
About Ingoo Kang
Ingoo Kang is a Senior Engineer at ON Semiconductor, with a background in semiconductor packaging and development. He has over two decades of experience in the industry, having worked for notable companies such as Fairchild Semiconductor, LG Innotek, and Samsung Electro-Mechanics.
Work at Onsemi
Ingoo Kang has been employed at ON Semiconductor as a Senior Engineer since 2018. In this role, he coordinates high voltage device technology development and oversees packaging assembly processes. His responsibilities include ensuring that the packaging meets industry standards and aligns with the company's technological advancements.
Previous Employment History
Before joining ON Semiconductor, Ingoo Kang worked at Fairchild Semiconductor from 2007 to 2010 as a Power Device Packaging Engineer. He then served as a Senior Engineer at LG Innotek from 2011 to 2018. His career began at WOOJIN Inc. as a Junior Engineer from 1997 to 2002, followed by a position at Samsung Electro-Mechanics from 2003 to 2007.
Education and Expertise
Ingoo Kang holds a Master's degree in Material Science and Engineering from Sungkyunkwan University, where he studied from 1995 to 1997. He possesses a VDA 6.3 Auditor certification, which underscores his expertise in quality management systems. His technical knowledge is complemented by extensive experience in semiconductor failure analysis and package reliability testing.
Technical Skills and Specializations
Ingoo Kang has a strong background in risk assessment and planning for SiC MOSFET and Diode, as well as Super Junction MOSFET discrete and module package development. He is skilled in automotive semiconductor supplier assessments, focusing on manufacturing capabilities and quality management systems. His experience includes diverse packaging processes such as SMT, wafer level packaging, and semiconductor packaging.
Industry Experience
With over two decades of experience in the semiconductor industry, Ingoo Kang has developed a comprehensive understanding of the APQP/PPAP process. His roles have involved significant responsibilities in technology development and quality assurance, contributing to advancements in semiconductor packaging and reliability.