Ingrid Mariano Hyland
About Ingrid Mariano Hyland
Ingrid Mariano Hyland is a Principal Engineer specializing in New Package Development at ON Semiconductor, with extensive experience in semiconductor package development and process improvement. She holds a Bachelor of Science in Electronics and Communications Engineering from the University of the East and has worked in various engineering roles across multiple companies since 2004.
Work at ON Semiconductor
Ingrid Mariano Hyland has been employed at ON Semiconductor since 2011. She currently holds the position of Principal Engineer in New Package Development, a role she has maintained since 2019 in Phoenix, Arizona. Prior to this, she served as Staff Engineer in New Package Development from 2014 to 2019 and as Engineer II in the same department from 2013 to 2014. Her initial role at ON Semiconductor was as Engineer II in Carmona, Philippines, from 2011 to 2012. Throughout her tenure, she has demonstrated strong leadership skills and a proactive approach to her work.
Education and Expertise
Ingrid Mariano Hyland earned her Bachelor of Science degree in Electronics and Communications Engineering from the University of the East, completing her studies from 1995 to 2000. She possesses strong technical expertise in package development and LF designs across various semiconductor packages. Her proficiency includes advanced tools such as CAD, Cadence, SAS JMP design of experiments, and Bonding Diagram System.
Background in Semiconductor Engineering
Before her extensive career at ON Semiconductor, Ingrid worked at Amertron as a Wirebond Process Engineer in the Lightning Department for eight months in 2005 in Paranaque, Philippines. She also gained experience at Cypress Semiconductor Corporation as an Engineering Trainee in Front of Line Engineering for six months in 2004 in Gen. Trias, Cavite. This background has contributed to her comprehensive understanding of semiconductor processes.
Achievements in Process Improvement
Ingrid Mariano Hyland has a proven track record in implementing process improvements and conducting failure analysis using the 6σ Discipline (DMAIC). She has established and built relationships with both internal and external stakeholders, including suppliers and international teams, which has enhanced her effectiveness in her engineering roles.