Jaejoon Ahn
About Jaejoon Ahn
Jaejoon Ahn is a Principal Engineer of Package Development RnD at onsemi, with extensive experience in interconnection technology and package development. He previously held managerial roles at SK hynix and SMART Modular Technologies, contributing significantly to advancements in memory packaging and production processes.
Current Role at Onsemi
Jaejoon Ahn currently serves as the Principal Engineer of Package Development R&D at Onsemi, a position he has held since 2022. His work is based in Bucheon, where he focuses on advancing packaging technologies. Ahn's role involves overseeing research and development initiatives aimed at improving package design and performance. His expertise in interconnection technology plays a significant role in driving innovation within the company.
Previous Experience at SK hynix
Before joining Onsemi, Jaejoon Ahn worked at SK hynix as the Manager of Package Development from 2008 to 2015. During his seven-year tenure in Icheon, Gyeonggi-do, Korea, he was responsible for leading various package development projects. His experience at SK hynix provided him with a solid foundation in the semiconductor industry and package engineering.
Career at SMART Modular Technologies
Ahn spent seven years at SMART Modular Technologies from 2015 to 2022, where he held the role of Package Development Engineering and Project Management for MCP SiP. Based in Sao Paulo, he played a crucial role in establishing the first package pilot line in Latin America. His contributions included leading the development of the first mass-produced Samsung eMCP memory SiP in the region and creating the world's thinnest 16-stack eMMC package.
Educational Background in Electronics Engineering
Jaejoon Ahn pursued his education at Konkuk University, where he studied Electronics Engineering. He achieved his Bachelor's degree in 2003. This academic background laid the groundwork for his extensive career in package development and engineering within the semiconductor field.
Expertise in Interconnection Technology
Ahn possesses specialized expertise in interconnection technology, particularly in wire bonding processes. He has experience working with various wire materials, including gold (Au), silver (Ag), copper (Cu), and aluminum (Al). His knowledge in this area is complemented by a strong understanding of mass production and development processes, including OSAT and IDM.