Jake Herbert Castillo
About Jake Herbert Castillo
Jake Herbert Castillo is a Senior Process Engineer currently employed at onsemi in Tarlac City, Philippines. He has extensive experience in the semiconductor industry, having previously worked at TEAM PACIFIC CORPORATION and Vishay Intertechnology, Inc., and holds a Lean Six Sigma Green Belt certification.
Work at Onsemi
Jake Herbert Castillo has been employed at onsemi as a Senior Process Engineer since 2021. He is based in Tarlac City, Central Luzon, Philippines. In this role, he is responsible for overseeing various processes related to semiconductor manufacturing. His expertise includes managing advanced wafer sawing processes and ensuring quality control through the use of specialized equipment.
Previous Experience at Vishay Intertechnology
Prior to his current position, Jake worked at Vishay Intertechnology, Inc. as a Senior Process Engineer from 2017 to 2021. His tenure lasted four years in the National Capital Region, Philippines. In this capacity, he focused on process engineering within the semiconductor sector, contributing to the development and improvement of manufacturing processes.
Role at TEAM PACIFIC CORPORATION
Jake Herbert Castillo held multiple roles at TEAM PACIFIC CORPORATION. He served as Product Qualification - Section Head from 2015 to 2017, overseeing product qualification processes for two years. Additionally, he worked as a Sustaining Engineer from 2010 to 2015, where he contributed to sustaining engineering efforts for five years in the National Capital Region, Philippines.
Technical Skills and Expertise
Jake possesses a range of technical skills relevant to the semiconductor industry. He has basic knowledge in wafer fabrication processes, particularly in Opto: GaAs/Silicon. He operates advanced wafer sawing machines, including Disco DAD341, DAD3350, DFD6240, DFD6341, and DFD6362. He is also proficient in using the CAMTEK Eagle T-i AOI machine for integrated circuit sawn wafer inspection.
Certifications and Methodologies
Jake is a certified Lean Six Sigma Green Belt, indicating his proficiency in process improvement methodologies. He has led the qualification of the Taiko Wafer process using circular cutting technology with the Disco DAD3350 machine. Additionally, he utilizes various technical and analytical tools such as PFMEA, APQP, Control Plan, SPC, MSA, DOE, Six Sigma DMAIC, PDCA, 8D, and RCA in his work.