Jerome Teysseyre
About Jerome Teysseyre
Jerome Teysseyre serves as the Vice President of Package Development and Engineering at ON Semiconductor, focusing on packaging solutions for wide band gap materials such as SiC and GaN. He has extensive experience in the field, having held various leadership roles at companies like STMicroelectronics, Fairchild, and Sofradir.
Current Role at Onsemi
Jerome Teysseyre serves as the Vice President of Package Development and Engineering at ON Semiconductor. He has held this position since 2016, working from the company's headquarters in Phoenix, Arizona. In this role, he focuses on developing packaging solutions for wide band gap materials, specifically silicon carbide (SiC) and gallium nitride (GaN). He guides teams in the research and development of packaging solutions for lidar and radar technologies, as well as automotive camera image sensors. His leadership extends to the development of high-performance automotive packages and high-efficiency solutions for cloud computing applications.
Previous Experience at STMicroelectronics
Before joining ON Semiconductor, Jerome Teysseyre worked at STMicroelectronics in various capacities. He served as the Director of Corporate Packaging and Automation from 2010 to 2014 in Singapore. Prior to this role, he was the Assembly Technologies R&D Manager in Grenoble, France, from 2000 to 2009. His experience at STMicroelectronics contributed to his expertise in packaging technologies and automation processes.
Experience at Fairchild and Sofradir
Jerome Teysseyre held the position of Vice President of Assembly Technology and Package Development Group at Fairchild from 2014 to 2016 in Singapore. His role involved overseeing assembly technology and package development initiatives. Additionally, he worked at Sofradir as the Manager of R&D for Packaging, Bumping, and Wafer Preparation for one year in France from 2009 to 2010. These roles further enhanced his knowledge and skills in packaging technologies.
Educational Background in Material Sciences
Jerome Teysseyre studied Material Sciences at Université Joseph Fourier (Grenoble I), where he earned his engineering degree from 1997 to 2000. This educational background provided him with a solid foundation in materials science, which has been essential in his career focused on packaging solutions and engineering.
Leadership in Packaging Development
In his current and previous roles, Jerome Teysseyre has demonstrated leadership in the development of advanced packaging solutions. He leads initiatives focused on high-performance automotive top and dual cool packages across various voltage nodes. His work also includes overseeing the creation of System in Package (SIP) and Multi-Chip Module (MCM) solutions tailored for cloud computing applications, showcasing his commitment to innovation in packaging technology.