Jeungdae Kim
About Jeungdae Kim
Jeungdae Kim is a Principal Packaging Engineer with nearly three decades of experience in semiconductor packaging development, currently working at ON Semiconductor in Suzhou, China. He has previously held a similar role at Fairchild Semiconductor Korea and studied at Samsung's internal college.
Work at ON Semiconductor
Jeungdae Kim has been employed at ON Semiconductor as a Principal Packaging Engineer since 2014. In this role, he focuses on developing processes and equipment for new module packages. His work is essential for advancing packaging technologies within the company. He operates out of the Suzhou facility in Jiangsu Province, China, contributing to the company's international operations.
Previous Experience at Fairchild Semiconductor
Before joining ON Semiconductor, Jeungdae Kim worked at Fairchild Semiconductor KOREA for 14 years, from 2000 to 2014. He held the position of Principal Engineer, where he gained significant expertise in semiconductor packaging. His tenure at Fairchild Semiconductor provided him with a strong foundation in the field, which he has built upon in his current role.
Education and Expertise
Jeungdae Kim studied at Samsung's internal college, where he specialized in Semiconductor from 1995 to 1997. This educational background has equipped him with the necessary skills and knowledge to excel in semiconductor packaging development. His extensive experience spans nearly three decades, combining his academic training with practical engineering roles in both Korea and China.
Background in Semiconductor Packaging Development
Jeungdae Kim possesses extensive experience in semiconductor packaging development, with a career that spans nearly thirty years. His work has involved various aspects of packaging engineering, particularly in international settings. His dual experience in Korea and China allows him to navigate the complexities of global semiconductor operations effectively.